JCET ★ 0Sign in to vote

JCET Group provides integrated-circuit manufacturing and technology services, with an emphasis on semiconductor packaging and testing. Its service portfolio includes package design, wafer bumping and probing, assembly, final test, and turnkey manufacturing support. The company’s technologies include wafer-level packaging, system-in-package, flip-chip, wire bonding, and packaging for MEMS, sensors, and power devices. JCET serves customers building products for computing, storage, communications, automotive, and other applications, supporting the back-end stages of semiconductor production.